Multi-physical, multi-scale and multidisciplinary modeling of smart structures and materials.

Many modern technological devices, in particular electronics, sensors/actuators, MEMS and NEMS, extensively use multi-coupled Smart Materials characterized by the interaction of several fields: thermal, mechanical, electric and magnetic among others. These materials are increasingly subjected to sophisticated manufacturing processes that include miniaturization for micro-devices. In addition, they are used in applications under very fast phenomena such as ultrasound waves or pulsed operation modes. In the present session, contributions on any aspects related to the modelling of these materials and structures are welcome.